BDN11-3CB/A01

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Part No :: BDN11-3CB/A01

Manufacturer: CTS Corporation

Description: HEATSINK CPU W/ADHESIVE 1.11"SQ

Catalog: Thermal - Heat Sinks

Shipped from: HK warehouse

Expected Shipping Date: Aug 09 - Aug 13 2025

DataSheet: BDN11-3CB/A01 PDF

Availability: 3200 pieces

Unit Price: ~~$2.56000~~

Current price of BDN11-3CB/A01 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]

BDN11-3CB/A01 Specifications

Type	Description
Series:	BDN
Package:	Box
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	1.110" (28.19mm)
Width:	1.110" (28.19mm)
Diameter:	-
Fin Height:	0.355" (9.02mm)
Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	7.20°C/W @ 400 LFM
Thermal Resistance @ Natural:	20.90°C/W
Material:	Aluminum
Material Finish:	Black Anodized

Please confirm the specifications of the products when ordering.
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Delivery time: At the same day (Order deadline is 2pm, HK Time).
Delivery date: usually 2 to 7 working days.
It is unable to appoint a date of delivery.
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