Semiconductor giant Intel recently stated that the first two cutting-edge high numerical aperture (High NA) lithography machines of semiconductor equipment giant ASML have officially entered production at its factory, and the performance of the equipment is more reliable than previous models.
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According to reports, Intel's senior chief engineer Steve Carson pointed out at a conference in San Jose, California that Intel has used ASML's high numerical aperture lithography machine to produce 30,000 wafers in a quarter. These wafers are large silicon wafers sufficient to produce thousands of computing chips.
In 2024, Intel becomes the first chipmaker in the world to receive these advanced devices, which are expected to produce smaller and faster computing chips than previous ASML equipment. In preliminary tests, ASML's new high-numerical aperture machines are about twice as reliable as previous-generation machines, Carson said. "We're producing wafers at a steady rate, which is a huge benefit to the platform," Carson said.
ASML's new equipment can use light beams to print circuit patterns on chips, while completing the same amount of work as earlier equipment with fewer exposures, saving time and money. Carson pointed out that early results from Intel's factory show that the High NA EUV machine can complete the work of the earlier machine with three exposures and about 40 steps, while only one exposure and "single-digit" processing steps are required.
Intel also said it is using its 18A manufacturing technology to test High NA devices, which is scheduled to go into mass production with a new generation of PC chips later this year. In addition, Intel also plans to use its next-generation manufacturing technology 14A to fully invest in the production of high numerical aperture machines, but has not yet disclosed the mass production date of this technology.