Japan's SoftBank acquires British AI chipmaker Graphcore
Japan's SoftBank Group has bought artificial intelligence chipmaker Graphcore for an undisclosed sum, ending long-running speculation over the company's future.
2024-07-12
Media
ARM microcontroller has up to 512kbytes embedded ReRAM
Nuvoton Technology Corp. (Hsinchu, Taiwan) has announced the M2L31Cortex-M23 microcontroller series with embedded ReRAM.
2024-07-05
Media
GlobalFoundries acquires Tagore’s GaN IP portfolio
GlobalFoundries (GF) has acquired Tagore Technology’s Power Gallium Nitride (GaN) intellectual property (IP) portfolio.
2024-07-03
Media
SMC opens second power MOSFET and diode fab in Nanjing
SMC Diode Solutions, the American-led semiconductor design and manufacturing company, has opened its second power discrete fab in Nanjing, China.
2024-07-02
Media
Isolated gate driver combo chip with Power-Thru adds external transformer
Allegro MicroSystems has launched the third product in its High Voltage Power-Thru portfolio, allowing for an external transformer.
2024-06-20
Media
Tensilica 5 DSP for automotive AI audio processing
NXP Semiconductors has developed a digital signal processing (DSP) chip for AI-based audio in software-defined vehicles (SDVs) and software-defined radio (SDR).
2024-06-19
Media
WIN Semiconductors Announces beta release of NP12-0B mmWave RF GaN-on-SiC technology
NP12-0B platform provides rugged RF, DC performance with added moisture resistance enabling the use of plastic packages for high-performance power applications
2024-06-14
Media
Element Six and Orbray partner to deliver high-quality wafer-scale single-crystal synthetic diamond
Materials companies Element Six (E6) and Orbray have announced a strategic collaboration to deliver high-quality wafer-scale single crystal (SC) synthetic diamond.
2024-06-13
Media
Microsoft, OpenAI and Nvidia investigated anti-monopoly laws
The US Justice Department and the Federal Trade Commission have reached an agreement on investigations into key protagonists in the AI market.
2024-06-11
Media
VIS and NXP to Establish a Joint Venture to Build and Operate a New 300mm Semiconductor Wafer Manufacturing Facility in Singapore.
Vanguard International Semiconductor (VIS) and NXP Semiconductors are partnering up to create a manufacturing joint venture.
2024-06-07
Media
Top