On January 14, US RF manufacturer MACOM announced plans to invest US$345 million to comprehensively upgrade its semiconductor wafer manufacturing plants in Massachusetts and North Carolina.
Specifically, the company's Massachusetts factory will expand the clean room, upgrade the existing 4-inch wafer (involving GaAs, GaN, silicon and other III-V materials) production line, and introduce advanced 6-inch silicon carbide-based gallium nitride (GaN-on-SiC) manufacturing technology.
At the same time, the factory's infrastructure, such as HVAC, water, electricity and solar energy systems, will also be fully upgraded. The North Carolina plant will focus on improving the production capacity of 6-inch wafers and installing advanced metal organic chemical vapor deposition (MOCVD) equipment to support the development of radio frequency silicon carbide-based gallium nitride (RF GaN-on-SiC) processes.
“This investment represents not only an upgrade of MACOM’s existing manufacturing capabilities, but also a significant strategic move for the future of semiconductor technology,” said Stephen G. Daly, MACOM’s President and CEO. “By increasing our domestic semiconductor manufacturing capabilities, we can better serve our customers and drive innovation.”
