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Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | TO-252 (DPak) |
Attachment Method: | SMD Pad |
Shape: | Rectangular, Fins |
Length: | 0.320" (8.13mm) |
Width: | 0.790" (20.07mm) |
Diameter: | - |
Fin Height: | 0.390" (9.91mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | - |
Thermal Resistance @ Natural: | 25.00°C/W |
Material: | Copper |
Material Finish: | Tin |
HEAT SINK COPPER DPAK TO-252
IC CPLD 144MC 10NS 100QFP