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Type | Description |
---|---|
Series: | - |
Package: | Jar |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter: | - |
Melting Point: | 281°F (138°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Jar, 1.76 oz (50g) |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
WIRE MARKER, 0.75 IN H
SLDR PASTE NO-CLN SN42/BI58 50G
CONN IC DIP SOCKET 4POS TIN-LEAD
.050 X .050 C.L. FEMALE IDC ASSE