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Type | Description |
---|---|
Series: | HF212 |
Package: | Bulk |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | - |
Melting Point: | 423°F (217°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Jar, 21.16 oz (600g) |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | - |
SOLDER PASTE HF 212 - 600GRAM JA
97SC 400 2% .022DIA 23AWG
H SERIES, M5.0X0.8 THREADED INSE
IC EEPROM 4KBIT I2C 1MHZ 8UDFN