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Type | Description |
---|---|
Series: | C511™ |
Package: | Spool |
Part Status: | Active |
Type: | Wire Solder |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | 0.022" (0.56mm) |
Melting Point: | 423°F (217°C) |
Flux Type: | No-Clean |
Wire Gauge: | 23 AWG, 24 SWG |
Process: | Lead Free |
Form: | Spool, 8.8 oz (250g) |
Shelf Life: | - |
Shelf Life Start: | - |
Storage/Refrigeration Temperature: | - |
RES 187 KOHM 0.1% 1/16W 0603
97SC C511 2% .022DIA 22AWG 24SWG
CBL FMALE TO WIRE LEAD 17P 6.56'
HIGH POWER RIIOT DEVELOPMENT KIT