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Type | Description |
---|---|
Series: | HF250DP |
Package: | Bulk |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) |
Diameter: | - |
Melting Point: | 423°F (217°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Cartridge, 0.88 oz (25g) |
Shelf Life: | - |
Shelf Life Start: | - |
Storage/Refrigeration Temperature: | - |
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