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Type | Description |
---|---|
Series: | - |
Package: | Jar |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Ag40Cu30Zn28Ni2 (40/30/28/2) |
Diameter: | - |
Melting Point: | 1220 ~ 1435°F (660 ~ 780°C) |
Flux Type: | - |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Jar, 1 oz (28g) |
Shelf Life: | 9 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 41°F ~ 77°F (5°C ~ 25°C) |
RES ARRAY 15 RES 150 OHM 16DIP
NANO-D 25POS FEMALE W/ 18IN WIRE
M12-M12 4P R/A PVC CBL SHTH 5M
1240-FPA SILVER SOLDER PASTE --