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Type | Description |
---|---|
Series: | 500 |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 16 (2 x 8) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 25.0µin (0.63µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
CAPACITOR MLP 0.22UF 400V RADIAL
CONN IC DIP SOCKET 16POS GOLD
AS INTERFACE SEN/ACT MODULE
IC CPLD 512MC 10NS 208QFP