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Type | Description |
---|---|
Series: | - |
Package: | Tray |
Part Status: | Active |
Type: | LGA |
Number of Positions or Pins (Grid): | 3647 |
Pitch - Mating: | 0.039" (1.00mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Copper Alloy |
Mounting Type: | Surface Mount |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.034" (0.86mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
Contact Material - Post: | Copper Alloy |
Housing Material: | Thermoplastic |
Operating Temperature: | - |
FIXED IND 470UH 87MA 9.2 OHM SMD
SIDAC 190-215V 1A DO214
CONN SOCKET LGA 3647POS GOLD
CONFOR CF-42SC-015/PSA DAMPING F