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Type | Description |
---|---|
Series: | 800 |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.9" (22.86mm) Row Spacing |
Number of Positions or Pins (Grid): | 64 (2 x 32) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | Flash |
Contact Material - Mating: | Copper Alloy |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | - |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | - |
Housing Material: | Polyester |
Operating Temperature: | -55°C ~ 105°C |
BLC10G19XS-551AV/SOT1258/TRAYDP
CONN IC DIP SOCKET 64POS GOLD
FILLER PANEL,FLAT,W/DBL'D'3UX3HP