Current price of 210-1-18-003 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]
Type | Description |
---|---|
Series: | - |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 18 (2 x 9) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | - |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass |
Housing Material: | Polybutylene Terephthalate (PBT) |
Operating Temperature: | -40°C ~ 105°C |
2W 82 OHMS 2%
MEMS OSC XO 25.0000MHZ H/LV-CMOS
CONN IC DIP SOCKET 18POS GOLD
OC-AT-S-FA-080F140O-001-0254