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Type | Description |
---|---|
Series: | - |
Package: | Tube |
Part Status: | Obsolete |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 24 (2 x 12) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | - |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Thermoplastic, Polyester |
Operating Temperature: | -40°C ~ 105°C |
TRANS PNP 40V 0.2A TO-18
FIXED IND 4.5UH 6.5A 14 MOHM SMD
CONN IC DIP SOCKET 24POS GOLD
M55342E 25PPM 0705 23.7K 1% P T5