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Type | Description |
---|---|
Series: | ICA |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 8 (2 x 4) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass |
Housing Material: | Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 105°C |
MEMS OSC XO 74.1760MHZ H/LV-CMOS
CONN D-SUB RCPT 15P PNL MNT SLDR
HOOK-UP STRND 26AWG 600V VIOLET
CONN IC DIP SOCKET 8POS GOLD