APF30-30-13CB

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Part No :: APF30-30-13CB

Manufacturer: CTS Corporation

Description: HEATSINK LOW-PROFILE FORGED

Catalog: Thermal - Heat Sinks

Shipped from: HK warehouse

Expected Shipping Date: Jul 22 - Jul 26 2025

DataSheet: APF30-30-13CB PDF

Availability: 400 pieces

Unit Price: ~~$5.79000~~

Current price of APF30-30-13CB is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]

APF30-30-13CB Specifications

Type	Description
Series:	APF
Package:	Box
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Not Included)
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	-
Fin Height:	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	2.50°C/W @ 200 LFM
Thermal Resistance @ Natural:	-
Material:	Aluminum
Material Finish:	Black Anodized

Please confirm the specifications of the products when ordering.
MOQ means the minimum order quantity required to purchase each parts.
If you have special order instructions,please note it on the ordering pages.
The Pre-Shipment Inspection (PSI) will be applied.
You can email us to change the order details before shipment.
Orders cannot be canceled after shipping the packages.

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Delivery time: At the same day (Order deadline is 2pm, HK Time).
Delivery date: usually 2 to 7 working days.
It is unable to appoint a date of delivery.
Tracking number will be sent once your order has been shipped. (It may take up to 24 hours before carriers display the info.)

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