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Type | Description |
---|---|
Series: | APF |
Package: | Box |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Fins |
Length: | 0.748" (19.00mm) |
Width: | 0.748" (19.00mm) |
Diameter: | - |
Fin Height: | 0.250" (6.35mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 7.10°C/W @ 200 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Black Anodized |
RES 12.7K OHM 0.1% 1/10W 0603
RES 37.4K OHM 0.4W 0.5% AXIAL
HEATSINK FORGED W/ADHESIVE TAPE
B33,B435,SILVER,3" X 2",FIT