APF30-30-06CB

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Part No :: APF30-30-06CB

Manufacturer: CTS Corporation

Description: HEATSINK LOW-PROFILE FORGED

Catalog: Thermal - Heat Sinks

Shipped from: HK warehouse

Expected Shipping Date: Aug 09 - Aug 13 2025

DataSheet: APF30-30-06CB PDF

Availability: 324 pieces

Unit Price: ~~$5.48000~~

Current price of APF30-30-06CB is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]

APF30-30-06CB Specifications

Type	Description
Series:	APF
Package:	Box
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Not Included)
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	-
Fin Height:	0.250" (6.35mm)
Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	4.40°C/W @ 200 LFM
Thermal Resistance @ Natural:	-
Material:	Aluminum
Material Finish:	Black Anodized

Please confirm the specifications of the products when ordering.
MOQ means the minimum order quantity required to purchase each parts.
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The Pre-Shipment Inspection (PSI) will be applied.
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Delivery time: At the same day (Order deadline is 2pm, HK Time).
Delivery date: usually 2 to 7 working days.
It is unable to appoint a date of delivery.
Tracking number will be sent once your order has been shipped. (It may take up to 24 hours before carriers display the info.)

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