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Type | Description |
---|---|
Series: | BG |
Package: | Box |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA, CPU, GPU |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Angled Fins |
Length: | 0.591" (15.00mm) |
Width: | 0.591" (15.00mm) |
Diameter: | - |
Fin Height: | 0.295" (7.50mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | - |
Thermal Resistance @ Natural: | 18.00°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
RES CHAS MNT 1.2 OHM 10% 300W
BGA HEATSINK W/TAPE
DC DC CONVERTER 5V 5V 2W
RES CHAS MNT 2K OHM 0.1% 5W