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Type | Description |
---|---|
Series: | Tflex™ SF600 |
Package: | Bulk |
Part Status: | Active |
Usage: | - |
Type: | Gap Filler Pad, Sheet |
Shape: | Rectangular |
Outline: | 228.60mm x 215.90mm |
Thickness: | 0.0800" (2.032mm) |
Material: | Non-Silicone, Boron Nitride Filled |
Adhesive: | - |
Backing, Carrier: | - |
Color: | Pink |
Thermal Resistivity: | - |
Thermal Conductivity: | 3.0W/m-K |
FUSE HLDR CART 250V 20A PNL MNT
THERM PAD 228.6MMX215.9MM PINK
IC SUPERVISOR 1 CHANNEL SOT25
PFC MEGAPAC