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Type | Description |
---|---|
Series: | Tflex™ 300 |
Package: | Bulk |
Part Status: | Active |
Usage: | - |
Type: | Gap Filler Pad, Sheet |
Shape: | Square |
Outline: | 457.20mm x 457.20mm |
Thickness: | 0.0600" (1.524mm) |
Material: | Silicone Elastomer |
Adhesive: | - |
Backing, Carrier: | - |
Color: | Green |
Thermal Resistivity: | 2.11°C/W |
Thermal Conductivity: | 1.2W/m-K |
RES ARRAY 19 RES 1M OHM 20SOIC
MEMS OSC XO 40.5000MHZ H/LV-CMOS
CONN RCPT HSNG 12POS DUAL KEY Y
THERM PAD 457.2MMX457.2MM GREEN