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Type | Description |
---|---|
Series: | Tflex™ HD400 |
Package: | Box |
Part Status: | Active |
Usage: | - |
Type: | Gap Filler Pad, Sheet |
Shape: | Square |
Outline: | 457.20mm x 457.20mm |
Thickness: | 0.0900" (2.286mm) |
Material: | Silicone, Ceramic Filled |
Adhesive: | Tacky - Both Sides |
Backing, Carrier: | - |
Color: | Blue |
Thermal Resistivity: | - |
Thermal Conductivity: | 4.0W/m-K |
CAP CER 820PF 200V NP0 1808
MEMS OSC XO 66.6000MHZ H/LV-CMOS
WIRE 20AWG GRY STND
THERM PAD 457.2MMX457.2MM BLUE