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Type | Description |
---|---|
Series: | Proto-Advantage |
Package: | Bulk |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | TSSOP |
Number of Positions: | 64 |
Pitch: | 0.020" (0.50mm) |
Board Thickness: | 0.062" (1.57mm) 1/16" |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 1.000" x 3.200" (25.40mm x 81.28mm) |
BREADBOARD TERM STRIP 6.70X2.60"
TSSOP-64-EXP-PAD TO DIP-64 SMT
NI/C FILLED SILICONE; 0.062" DIA
CUNO CTG-KLEAN SYSTEM FILTER PAC