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Type | Description |
---|---|
Series: | - |
Package: | Bag |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | SOIC, SOP, SSOP |
Number of Positions: | 24 |
Pitch: | 0.100" (2.54mm) |
Board Thickness: | 0.063" (1.60mm) |
Material: | FR4 Epoxy Glass |
Size / Dimension: | - |
MEMS OSC XO 8.1920MHZ LVCM LVTTL
SENS HUM/TMP 3.3V I2C 3% SMD 1=5
SOP-24/SSOP-24/SOIC-24 TO DIP-24
TOUCH SCREEN CAPACITIVE 15.65"