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Type | Description |
---|---|
Series: | Proto-Advantage |
Package: | Bulk |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | BGA |
Number of Positions: | 25 |
Pitch: | 0.039" (1.00mm) |
Board Thickness: | 0.063" (1.60mm) |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 1.000" L x 1.300" W (25.40mm x 33.02mm) |
RES ARRAY 3 RES 82 OHM 6SIP
CERAMIC RES 2.0000MHZ 30PF SMD
MEMORY CARD SDHC 8GB CLASS 4 TLC
BGA-25 TO DIP-25 SMT ADAPTER (1.