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Type | Description |
---|---|
Series: | Proto-Advantage |
Package: | Bulk |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | DFN, MLP |
Number of Positions: | 8 |
Pitch: | 0.050" (1.27mm) |
Board Thickness: | 0.063" (1.60mm) |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 1.000" L x 0.600" W (25.40mm x 15.24mm) |
RES ARRAY 10 RES 68 OHM 20SOIC
IC REG BOOST ADJ 1.5A 8MSOP
DFN-8/MLP-8 TO DIP-12 SMT ADAPTE
LED AMBER DIFF RECT 2MMX4MM T/H