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Type | Description |
---|---|
Series: | - |
Package: | Jar |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn63Pb37 (63/37) |
Diameter: | - |
Melting Point: | 361°F (183°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Leaded |
Form: | Jar, 8.8 oz (250g) |
Shelf Life: | 12 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
SOLDER PASTE SN63/PB37 250G T5
PWR ENT RCPT IEC320-C20 PANEL QC
FFC CABLE 1.00MM 10 CONDUCTOR 30