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Type | Description |
---|---|
Series: | R500 |
Package: | Syringe |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn63Pb37 (63/37) |
Diameter: | - |
Melting Point: | 361°F (183°C) |
Flux Type: | Water Soluble |
Wire Gauge: | - |
Process: | Leaded |
Form: | Syringe, 1.23 oz (35g), 10cc |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
RES SMD 562 OHM 1% 3/4W 2010
CAP ALUM 15000UF 20% 35V SNAP
CAP ALUM 8F 3V 1500H
SOLDERPASTE WATER SOL SYR 35GM