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Type | Description |
---|---|
Series: | - |
Package: | Jar |
Part Status: | Active |
Type: | Solder Paste, Two Part Mix |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | - |
Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Jar, 0.53 oz (15g) |
Shelf Life: | 24 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 37°F ~ 77°F (3°C ~ 25°C) |
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