Current price of TS391SNL50 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | - |
Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Jar, 1.76 oz (50g) |
Shelf Life: | 12 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 68°F ~ 77°F (20°C ~ 25°C) |
COOLX POWER SUPPLY
THERMALLY STABLE SOLDER PASTE NO
CONN QSFP CAGE 1X3 W/HSINK R/A
22G 0.25" HP SERIES TIP ID .016"