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Type | Description |
---|---|
Series: | Smooth Flow™ |
Package: | Bulk |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Bi57Sn42Ag1 (57/42/1) |
Diameter: | - |
Melting Point: | 279°F (137°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | - |
Form: | Jar, 8.8 oz (250g) |
Shelf Life: | 12 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
RES 107K OHM 1% 1/4W 1206
SMOOTH FLOW LOW TEMP SOLDER PAST
DETENTED LEAF HINGE 52X57 POLYME
REPLACEMENT BLADE .080" GRY QTY5