Current price of 70-3205-1812 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]
Type | Description |
---|---|
Series: | NXG1 |
Package: | Bulk |
Part Status: | Obsolete |
Type: | Solder Paste |
Composition: | Sn99Cu0.7Ag0.3 (99/0.7/0.3) |
Diameter: | - |
Melting Point: | - |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Cartridge, 35.27 oz (1kg) |
Shelf Life: | 8 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
MICROPHONE BOOT 3.8 X 1.3 MM
S-EP INSERT 16P FEM PUSH-IN TERM
IC, MULTI CELL, SECOND PROTECTIO
SOLDER PASTE NXG1 NO CLEAN 1000G