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Type | Description |
---|---|
Series: | WS300 |
Package: | Bulk |
Part Status: | Not For New Designs |
Type: | Solder Paste |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | - |
Melting Point: | 423°F (217°C) |
Flux Type: | Water Soluble |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Syringe, 2.65 oz (75g) |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 35.6°F ~ 46.4°F (2°C ~ 8°C) |
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